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New Qualcomm: 5G modem and audio chip for smartphones

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New Qualcomm: 5G modem and audio chip for smartphones
Qualcomm has updated its range of devices. Among the new products are the X70 5G modem with a neuroblock, an audio chip for smartphones and network equipment that supports Wi-Fi 7.

New Qualcomm: 5G modem and audio chip for smartphones


The X70 modem, according to the company, is the first 5G device in its class to have an AI-controlled unit. It supports impressive connection speeds (10 and 3.5 Gbps downlink and uplink respectively) in all commercial bands. The main function of AI in the modem will be to optimize the quality of communication by reducing delay, monitoring the network and other processes.

In addition, the modem will consume 60% less power than the previous model. Also, the artificial intelligence of the device will help increase the autonomy of 5G smartphones. Among other things, it is worth noting that the modem has Qualcomm 5G PowerSafe technology of the 3rd generation. It is assumed that the modem will go in mobile devices as part of the Snapdragon 8 Gen 2 chipset.

Another novelty from the manufacturer was the FastConnect technology, which has a bandwidth of 5.8 Gbps. It is designed to work with systems that support Wi-Fi 7. The presence of 4K QAM modulation and the use of a 320 MHz channel will double the speed of pairing and coverage compared to the previous generation of chips.



Qualcomm also introduced QCC517x QCC307x audio platforms. They have support for the dynamically configurable aptX audio codec, Qualcomm Clear Voice Capture echo cancellation, and active noise reduction. The chips have a low latency of 68 ms and Bluetooth LE Audio compatibility - their power consumption is reduced by 20% compared to their predecessors. When audio chips will be introduced into new devices is still unknown.
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